Qualcomm Snapdragon 450 platform announced at MWC Shanghai 2017

Qualcomm Snapdragon 450 platform announced at MWC Shanghai 2017

This is also the first processor in the Snapdragon 400 series to be manufactured on a 14nm FinFET process. Compared to the Snapdragon 435, the new mobile processor boasts a 25 per cent increase in compute performance and a 25 per cent increase in graphics performance.

Catered to mid-range smartphones and tablets, the Snapdragon 450 is the first in its series to use 14nm FinFET manufacturing process and is created to deliver significant improvements in battery life, graphics and compute performance, imaging and LTE connectivity over its predecessor, the Snapdragon 435 Mobile Platform. Qualcomm is also very substantially raising their max clock speed, up to 1.8GHz on the 450 versus a max of 1.4GHz on the 435. It also comes with a support for enhanced dual camera at 13+13MP or single camera support up to 21MP.

This one, the Snapdragon 450, is aimed at budget phones, and aims to introduce a number of efficiency upgrades to help low-priced devices last all day like their mid-range and high-end rivals. This is paired with the Adreno 506 GPU, which Qualcomm notes as offering around a 25% increase in graphics performance compared to the Snapdragon 435, which carried the Adreno 505 GPU. Since mobile photography is transforming rather rapidly, Qualcomm has added a special support for real-time Bokeh (Live Bokeh) effects.

Qualcomm announced a new wearables platform incorporating LTE M1 (eMTC) and NB-IoT connectivity.

In terms of battery power, the 450 mobile platform’s power management offers four additional hours of battery back up and 30% less power consumption while gaming compared to 435 platform.

The Snapdragon 450 also supports 1920×1200 full HD support which means manufactures can bring smartphones with more vibrant displays in the mid range category in coming times.

With the Snapdragon 450 Mobile Platform, users can enjoy faster LTE speeds, thanks to the Snapdragon X9 LTE modem, which utilises 2x20MHz Carrier Aggregation in both downlink and uplink for peak speeds of 300 Mbps and 150 Mbps respectively. The Snapdragon 450 also supports USB 3.0 which is first in its tier to support fast USB data transfer.

The other improvements include improved CPU and GPU, battery life and connectivity.

The latest one from Qualcomm – the Snapdragon 450 will be made available for commercial use to the OEMs in the third quarter of this year.